| 波峰焊无铅化对策研究 |
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| 引用本文： | 彭勇,王万刚.波峰焊无铅化对策研究[J].热加工工艺,2010,39(7). |
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| 作者姓名： | 彭勇 王万刚 |
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| 作者单位： | 重庆城市管理职业学院信息工程学院,重庆,401331 |
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| 摘 要： | 从无铅焊料的易氧化性、腐蚀性、波峰焊温度曲线等方面分析了无铅焊接相对于Sn-Pb焊接的工艺特点,提出了无铅焊接过程中应注意的问题及解决方法,从而实现波峰焊的无铅化。
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| 关 键 词： | 波峰焊 无铅 温度曲线 |
Research on Lead-free Wave Soldering Measure |
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| PENG Yong,WANG Wangang.Research on Lead-free Wave Soldering Measure[J].Hot Working Technology,2010,39(7). |
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| Authors: | PENG Yong WANG Wangang |
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| Affiliation: | PENG Yong,WANG Wangang(College of Information Engineering,Chongqing City Management College,Chongqing 401331,China) |
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| Abstract: | The technology characteristics of lead-free soldering were compared with Sn-Pb soldering by solder causticity,solder oxidation and temperature curve.The attentive problems of lead-free soldering process and its solving measures were put forward in order to achieve transformation of lead-free wave soldering. |
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| Keywords: | wave soldering lead-flee temperature curve |
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