| 磁控溅射工艺参数对Cu,Al薄膜与Gd基底附着性的影响 |
| |
| 引用本文： | 郑小秋,吴卫,易荣喜,万建新,龙岸文. 磁控溅射工艺参数对Cu,Al薄膜与Gd基底附着性的影响[J]. 材料保护, 2009, 42(6) |
| |
| 作者姓名： | 郑小秋 吴卫 易荣喜 万建新 龙岸文 |
| |
| 作者单位： | 1. 井冈山大学工学院,江西,吉安,343009
2. 西华大学材料学院,四川,成都,610039 |
| |
| 基金项目： | 国家高技术研究发展计划(863计划) |
| |
| 摘 要： | 为了探讨Gd表面溅射保护膜的附着性能,利用直流磁控溅射技术在Gd基体上分别镀Cu和Al膜.用扫描电镜(SEM)和能谱仪对薄膜进行表征,用引拉法测定了薄膜的附着强度.结果表明:A1膜表面质量好,Al/Gd界面结合好,附着强度高,在优化工艺参数条件下薄膜附着强度可达到27.60 MPa;Cu膜表面质量较差,Cu/Gd界面结合差,附着强度低,在优化工艺参数条件下薄膜附着强度最高仅为3.02 MPa.
|
| 关 键 词： | 磁控溅射 Cu'Al薄膜 附着强度 cd基底 正交试验 |
Effect of Process Parameters on the Adhesion of Magnetron Sputtered Copper and Aluminum Coatings on Gadolinium Substrate |
| |
| ZHENG Xiao-qiu,WU Wei,YI Rong-xi,WAN Jian-xin,LONG An-wen. Effect of Process Parameters on the Adhesion of Magnetron Sputtered Copper and Aluminum Coatings on Gadolinium Substrate[J]. Journal of Materials Protection, 2009, 42(6) |
| |
| Authors: | ZHENG Xiao-qiu WU Wei YI Rong-xi WAN Jian-xin LONG An-wen |
| |
| Affiliation: | ZHENG Xiao-qiu1,WU Wei2,YI Rong-xi1,WAN Jian-xin1,LONG An-wen1(1.School of Engineering,Jinggangshan Univer-sity,Ji'an 343009,China,2.School of Materials,Xihua Uni-versity. Chengdu 610039. China) |
| |
| Abstract: | Cu and Al coatings were prepared on Gd substrate by making use of direct current magnetron sputtering technology.The characteristics of the coatings were investigated using a scanning electron microscope(SEM)and an energy dis-persive spectrometer(EDS).The adhesion to substrate of the coatings was tested using tension test.It was found that magne-tron sputtered Al coating had good surface quality and adhesion to substrate,and the one prepared at optimized sputtering parame-ters had s highest adhesion to subs... |
| |
| Keywords: | magnetron sputtering Cu Al coating adhesion to substrate Gd substrate orthogonal test |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
