不同等离子清洗在半导体封装中的应用研究

等离子清洗在半导体封装中越来越重要,不同激发机理的等离子存在一定的差异,通过分析直流电流等离子、射频等离子、微波等离子产生机理,研究对比了不同等离子清洗的清洗效果及特点。通过对比等离子清洗对不同封装工艺的影响,得出最合适倒装焊的底部填充、键合焊接、模塑包封工序的等离子清洗类型。研究结果既有助于对等离子清洗工艺理解的深入,也对不同封装工序选择何种类型等离子清洗有参考意义。

Study of Different Plasma Cleaning in Semiconductor Package

Plasma cleaning is more and more important in semiconductor package, and plasmas excited by different mechanisms are different. By analyzing exciting mechanisms, plasma clean effects and characterizations of direct current plasma, radio frequency plasma and microwave plasma are studied and analyzed. By comparing the influences on different package processes, the proper plasma type matching with under-fill, wire bond and moldingis proved. The results are helpful to understand plasma clean and select proper plasma type for package process.