| 高机械冲击应力下集成电路金属封装一种失效模式分析 |
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| 引用本文： | 张君利,苏杨,李波,刘海亮. 高机械冲击应力下集成电路金属封装一种失效模式分析[J]. 电子与封装, 2019, 19(7): 4-6,12 |
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| 作者姓名： | 张君利 苏杨 李波 刘海亮 |
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| 作者单位： | 华东光电集成器件研究所,江苏苏州,215163;华东光电集成器件研究所,江苏苏州,215163;华东光电集成器件研究所,江苏苏州,215163;华东光电集成器件研究所,江苏苏州,215163 |
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| 摘 要： | 对某集成电路在高机械冲击过载(冲击加速度为8000g^10000g、冲击脉冲宽度为2.5ms)时出现的金属封装引脚失效进行了分析。采用Proe软件建模和ANSYS结构力学软件对失效机理进行了仿真验证。根据失效机理,优化了环氧灌封工艺方法,使集成电路与其安装PCB及结构框架达到良好的一体化结构,解决了失效问题。
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| 关 键 词： | 集成电路 高机械冲击过载 机械应力 封装失效 灌封 |
An Failure Mode Analysis of IC Metal Package Under High Mechanical Shock Stress |
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| ZHANG Junli,SU Yang,LI Bo,LIU Hailiang. An Failure Mode Analysis of IC Metal Package Under High Mechanical Shock Stress[J]. Electronics & Packaging, 2019, 19(7): 4-6,12 |
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| Authors: | ZHANG Junli SU Yang LI Bo LIU Hailiang |
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| Affiliation: | (No.214 Institute of China North Industry Group Corporation,Suzhou 215163,China) |
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| Abstract: | Integrated circuit pins failure mode of metal package under high mechanical shock overload(shock acceleration of 8000g^10000g, shock pulse width of 2.5 ms)was analyzed. The failure mechanism was simulated and verified by using Proe modeling software and ANSYS structure mechanics simulation software. According to failure mechanism,the epoxy filling process was optimized,the integrated circuit and installed PCB and structure frame attained good integration structure,and the problem of failure was solved. |
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| Keywords: | integrated circuit high mechanical shock overload mechanical stress package failure encapsulation |
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