| KGD技术发展与挑战 |
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| 引用本文： | 恩云飞,黄云. KGD技术发展与挑战[J]. 电子质量, 2003, 0(9): U002-U004 |
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| 作者姓名： | 恩云飞 黄云 |
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| 作者单位： | 信息产业部电子第五研究所 |
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| 摘 要： | 军用和民用电子系统中模块化和小型化发展的迫切需求使裸芯片在国内有着广泛的用途和市场，尤其是在军用HIC和MCM应用领域，裸芯片质量和可靠性保证一直是人们关注的热点，本文论述了国外KGD技术发展现状，以及国内发展KGD技术面临的机遇与挑战，论述了已知良好芯片（KGD）保证的主要技术要求，重点介绍了KGD夹具技术和工艺流程，为国内KGD技术的发展提供了技术指导。
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| 关 键 词： | KGD技术 产品质量 可靠性 已知良好芯片 裸芯片 |
Development and Challenge of KGD Technology |
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| EN Yun-fei HUANG Yun The Fifth Research Institute of MII Guangzhou City. Development and Challenge of KGD Technology[J]. Electronics Quality, 2003, 0(9): U002-U004 |
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| Authors: | EN Yun-fei HUANG Yun The Fifth Research Institute of MII Guangzhou City |
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| Affiliation: | EN Yun-fei HUANG Yun The Fifth Research Institute of MII Guangzhou City,510610 |
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| Abstract: | The urgent demand of modular and miniaturization in military and civil electronic system, the bare die have been extensive used, especially in military HIC and MCM application field. The bare die quality and reliability guarantee are the hot point that people pay attention to always. This paper has discussed present situation of abroad KGD technology. KGD technology is faced with the challenge and good fortune in china. The major technical requirements of KGD have been discussed. |
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| Keywords: | bare die known good die (KGD) reliability |
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