铜及铜合金不同化学抛光工艺研究

对铜及铜合金化学抛光工艺进行了研究,考察了低浓度硝酸体系和双氧水体系对铜及其合金的抛光亮度、腐蚀失重以及对环境污染程度的影响。结果表明,低浓度硝酸体系抛光亮度高,适用范围广,对环境的污染较传统三酸体系少,虽然对铜及铜合金有一定的腐蚀,但返工对工件的尺寸影响不大,适用于冰箱、空调器等的蒸发管的抛光。双氧水抛光体系对铜及其合金腐蚀轻微,对环境的污染更少,但成本相对较高,适于对加工尺寸要求严格的铜及铜合金电子元件的化学抛光。

Study on different chemical polishing processes for copper and copper alloys

The chemical polishing process for copper and its alloy was studied. The influence of a low concentration nitric acid system and a hydrogen peroxide system on the polishing brightness,corrosion weight loss and environmental pollution level was discussed. The results showed that the low concentration nitric acid system has a high polishing brightness and a wide application areas,results in a great improvement in reducing environmental pollution as compared with the traditional three-acid system,and is suitable for polishing the evaporator pipes in refrigerator or air conditioner. Although it causes a slight corrosion of copper and its alloys,there is only a little effect on the size of workpiece during reprocessing. The hydrogen peroxide system features slight corrosion of copper and its alloys and less environmental pollution,but higher cost. It can be applied to chemical polishing of electronic components made of copper and copper alloys with strict request on the size and shape.