首页 | 本学科首页   官方微博 | 高级检索  
     

甲基四氢苯酐中温固化低粘环氧树脂体系研究
引用本文:吴健伟,于昕,付刚,匡宏,付春明.甲基四氢苯酐中温固化低粘环氧树脂体系研究[J].化学与粘合,2001(4):160-161,167.
作者姓名:吴健伟  于昕  付刚  匡宏  付春明
作者单位:黑龙江省石油化学研究院!黑龙江哈尔滨150040
摘    要:本文研究了甲基四氢苯酐中温固化低粘环氧树脂TDE-85的基本配方和固化条件,并着重研究了适用于该体系的促进剂,发现促进剂D(金属有机络合物)对该体系有较好的适用性,使其具有较长的使用期(室温>20天)和较高的中温固化活性,固化物具有良好的耐热性,该树脂体系适用于干法浸渍缠绕及RTM成型工艺。

关 键 词:甲基四氢苯酐  TDE-85  促进剂  固化  环氧树脂  胶粘剂
文章编号:1001-0017(2001)04-0160-02

Study on the Moderate Temperature Curing System of Methyltetrahydrophthalic Anhydride- Lower Viscosity Epoxy Resin
WU Jian-wei,YU Xin,FU Gang,KUANG Hong and FU Chun-ming.Study on the Moderate Temperature Curing System of Methyltetrahydrophthalic Anhydride- Lower Viscosity Epoxy Resin[J].Chemistry and Adhesion,2001(4):160-161,167.
Authors:WU Jian-wei  YU Xin  FU Gang  KUANG Hong and FU Chun-ming
Abstract:The accelerator for the moderate temperature curing system of methyltetrahydrophthalic anhydride/TDE-85 was studied,and the basic formula and curing conditions were discussed.It was found that the system catalyzed by accelerator D(metal organic chelate)had a long pot life and high curing activity and the cured product showed good heat resistance.This system could be used in prepregging,filament winding and resin transfer molding(RTM).
Keywords:methyl tetrahydrophthalic anhydride  TDE-85  accerlator  pot life  
本文献已被 CNKI 维普 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号