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玻璃基体化学镀镍-磷工艺研究
引用本文:李茸,刘祥萱,王煊军.玻璃基体化学镀镍-磷工艺研究[J].电镀与涂饰,2005,24(1):27-29.
作者姓名:李茸  刘祥萱  王煊军
作者单位:第二炮兵工程学院503教研室,陕西,西安,710025
摘    要:非晶态化学镀玻璃基体可用作计算机磁盘基板针对玻璃表面化学镀镍一磷镀层易出现剥皮、开裂等问题,研究了玻璃基材表面的性质,镍磷合金化学镀层结构、含磷量以及镀层韧性、内应力、结合力等对镀层开裂产生的影响一通过调整镀液成分,优化温度、pH值、施镀时间等工艺参数,获得了玻璃基体化学镀镍一磷的工艺配方

关 键 词:玻璃  化学镀  镍磷合金
文章编号:1004-257X(2005)01-0027-03

Researches on electroless Ni-P plating on glass substrate
LI Rong,LIU Xiang-xuan,WANG Xuan-jun.Researches on electroless Ni-P plating on glass substrate[J].Electroplating & Finishing,2005,24(1):27-29.
Authors:LI Rong  LIU Xiang-xuan  WANG Xuan-jun
Abstract:Glass substrate with amorphous electroless Ni-P deposit can be used as disk board of computer. To solve the general problems of cracking and peering appeared on the Ni-P deposits, the effects of surface properties of glass, structure of the Ni-P deposits and their phosphorus content, toughness, internal stress and adhesion of the deposits on the cracking of Ni-P deposit were investigated. By adjusting composition of plating solution, optimizing temperature, pH value of plating solution and plating time. A formula of Ni-P electroless plating process for glass substrate was obtained.
Keywords:glass  electroless plating  Ni-P alloy
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