Effects of annealing on the thermoelectric and microstructural properties of deformed n-type Bi2Te3-based compounds |
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Authors: | D M Lee C H Lim D C Cho Y S Lee C H Lee |
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Affiliation: | (1) Department of Metallurgical Engineering, College of Engineering, Inha University, 253 Yonghyun-dong, Nam-gu, 402-751 Incheon, Korea |
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Abstract: | We studied the effects of deformation and annealing of n-type 90Bi2Te3-5Sb2Te3-5Sb2Se3 thermoelectric compound. Hot-extrusion was conducted to prepare the deformed compound and then this compound was annealed
at 400°C for 1–24 hr. When the undoped cast-ingot was extruded, the compound was changed from p-type to n-type due to the
electrons generated during the extrusion process. For the compound extruded with SbI3-doped powders, the thermoelectric properties were also varied for the extrusion process. After annealing at 400°C more than
9 hr, the powder-extruded compound was recrystallized. This caused a decrease in carrier concentration and crystallographic
anisotropy. In case of the compound extruded at the ratio of 10:1, the Seebeck coefficient α and the electrical resistivity
ρ increased due to recrystallization. However, thermal conductivity κ of the compound decreased. This resulted in an increase
in the figure-of-merit from 1.23 × 10−3 to 1.63 × 10−3 K−1. |
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Keywords: | Bi2Te3 thermoelectric Seebeck coefficient powder extrusion deformation |
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