| 功率模块封装结构及其技术 |
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| 引用本文： | 龙乐. 功率模块封装结构及其技术[J]. 电子与封装, 2005, 5(11): 9-12,25 |
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| 作者姓名： | 龙乐 |
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| 作者单位： | 龙泉长柏路98号,1栋208室,四川,成都,610100 |
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| 摘 要： | 本文从封装角度评估功率电子系统集成的重要性。文中概述了多种功率模块的封装结构形式及其主要研发內容。另外还讨论了模块封装技术的一些新进展以及在功率电子电路系统集成中的地位和作用。
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| 关 键 词： | 功率模块 封装 基板 互连 |
| 文章编号： | 1681-1070（2005）11-09-04 |
| 收稿时间： | 2005-04-21 |
| 修稿时间： | 2005-04-21 |
Structure of the Power Electronics Modules Packaging and its Technologies |
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| Long Le. Structure of the Power Electronics Modules Packaging and its Technologies[J]. Electronics & Packaging, 2005, 5(11): 9-12,25 |
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| Authors: | Long Le |
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| Affiliation: | 1-208, 98^th Changbai Road, Longquan, Sichuan Chengdu 610100, China |
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| Abstract: | In this paper, the importance of the power electronics integrated in packaging is evaluated. Multistructure format and studing content of the power electronics modules are introduced and the new advancement of module packaging and its roles in the power electronics integrated system are also discussed. |
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| Keywords: | Power Electronics Modules Packaging Substrate Interconnect |
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