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SiGe HBT基区结构的优化对欧拉电压的影响
引用本文:王玉东,徐阳,张伟,李希有,刘爱华.SiGe HBT基区结构的优化对欧拉电压的影响[J].微电子学,2006,36(5):601-603.
作者姓名:王玉东  徐阳  张伟  李希有  刘爱华
作者单位:清华大学,微电子学研究所,北京,100084
摘    要:欧拉电压是SiGe HBT一项重要的直流参数,受到基区结构(如Ge组分)的影响。研究发现,高温过程会导致硼的外扩散,从而影响异质结的位置,使欧拉电压受到影响。实验发现,通过优化基区结构,加厚CB结处i-SiGe厚度,可获得VA=520 V,βVA=164,320 V的SiGe HBT。

关 键 词:SiGeHBT  欧拉电压  硼外扩散
文章编号:1004-3365(2006)05-0601-03
收稿时间:2006-04-29
修稿时间:2006-04-292006-06-22

Effect of Base Structure Optimization of SiGe HBTs on Early Voltage
WANG Yu-dong,XU Yang,ZHANG Wei,LI Xi-you,LIU Ai-hua.Effect of Base Structure Optimization of SiGe HBTs on Early Voltage[J].Microelectronics,2006,36(5):601-603.
Authors:WANG Yu-dong  XU Yang  ZHANG Wei  LI Xi-you  LIU Ai-hua
Affiliation:Institute of Microelectronics , Tsinghua University, Beij ing 100084, P. R. China
Abstract:As one of the important DC parameters of SiGe HBTs, Early voltage is affected by base structure, such as Ge content at the interface of collector-base junction. Effects of boron out-diffusion on Early voltage are investigated. When high temperature processes are involved in the fabrication of SiGe HBTs, boron atoms diffuse towards N-collector layer and emitter layer from SIMS analysis and the Ge content at the interface of collector-base junction decreases, so that the Early voltage decreases. By increasing the depth of i-SiGe at the collector and base interface, devices with VA = 520 V and flVA = 164,320 V are fabricated.
Keywords:SiGe HBT  Early voltage  Boron out-diffusion
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