Processing parameters for selective intermixing of GaAs/AIGaAs quantum wells

Some of the parameters which determine the amount of intermixing of GaAs/AIGaAs quantum wells (QWs) using SiO₂ capping and rapid thermal annealing (RTA) have been studied using photoluminescence (PL) techniques. The degree of intermixing of QWs was found to be larger for thicker SiO₂ capping layers and for shorter distances between the QWs and the oxide-wafer interface. A maximum PL energy difference of 90 meV was observed between the region covered by a 1.3 μm thick oxide layer and the non-oxide region in a wafer that was annealed at 1100° C for 15 s.