TA2／A3爆炸复合界面微观断裂机制的SEM原位研究SCIEI

借助ＳＥＭ对ＴＡ２／Ａ３爆炸复合界面（包括细小波状界面，中波界面及具有再入射流熔块的大波界面）的微观断裂机制进行了动态研究。结果表明，爆炸复合界面微观断裂机制是：微裂纹在波头夹杂或再入射流熔块内及熔块和基体界面处萌生，并在裂尖应力场作用下沿与外载垂直方向扩展。同时，沿ＴＡ２／Ａ３界面产生微裂纹并在外载作用下，相互连接而扩展。

IN SITU SEM OBSERVATION ON MICROFRACTURE OF TA2/A3 EXPLOSION CLADDING INTERFACE

In-situ SEM observations on TA2/A3 explosion cladding interfaces have been performed to examine the microfracture behaviour. The microfracture mechanism of explosion cladding TA2/A3 interface seems that the microcracks initiate inside the swirls or inside the molten material as well as at the boundary between the molten material and the A3 matrix,and penetrate into the nearby A3 matrix in the direction normal to the tensile load direction under the action of the crack-tip stress field. At the same time, the microcracks initiate along the TA2 /A3 interface, and link up under the tensile load. Terminal cleavage fracture takes place mainly in the recrystallized and grain abnormal growth region on the A3 side in the vicinity of TA2/A3 interface.Localized fracture takes place along the interface molten layer.