| MEMS材料力学性能测试方法 |
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| 引用本文： | 陈樟,苏伟,万敏.MEMS材料力学性能测试方法[J].微纳电子技术,2007,44(6):319-323. |
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| 作者姓名： | 陈樟 苏伟 万敏 |
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| 作者单位： | 1. 北京航空航天大学,机械工程及自动化学院,北京,100083
2. 中国工程物理研究院,电子工程研究所,四川,绵阳,621900 |
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| 摘 要： | 随着微机电系统(MEMS)的蓬勃发展,如何准确获得MEMS材料的力学性能参数成为当今研究的热点。由于尺度微小,试样的夹持、载荷的施加和测量、位移的测量等问题十分突出。本文对当今MEMS力学性能研究中一些典型的微测试方法,如纳米压痕法、单轴拉伸法、鼓膜法、微梁弯曲法及衬底曲率法等分别进行了阐述,详细介绍了这些方法的原理、优缺点以及可测得的力学性能参数。
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| 关 键 词： | 力学性能测试 微机电系统 纳米压痕 单轴拉伸 鼓膜 |
| 文章编号： | 1671-4776（2007）06-0319-05 |
| 修稿时间： | 2006-12-08 |
Test Methods for MEMS Material Mechanical Properties |
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| CHEN Zhang,SU Wei,WAN Min.Test Methods for MEMS Material Mechanical Properties[J].Micronanoelectronic Technology,2007,44(6):319-323. |
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| Authors: | CHEN Zhang SU Wei WAN Min |
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| Affiliation: | 1,School of Mechanical Engineering and Automation, Beihang University, Beijing 100083, China; 2.Insititute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621900, China |
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| Abstract: | With the rapid development of micro electro mechanical system(MEMS),mechanical properties of MEMS are being focused. Because of the miniature size,it is difficult to handle the microsample,impose load and measure displacement. Some of test techniques nowadays,such as nanoindentation,tensile testing,bulge test,microbeam bending test and wafer curvature measurement are discussed. The principles,advantages,shortcomings and the parameters of mechanical properties that could be measured by these methods are introduced. |
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| Keywords: | mechanical properties MEMS nanoindentation tensile bulge |
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