| 微小互连高度下的电子封装焊点微观组织 |
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| 引用本文： | 王波,莫丽萍,吴丰顺,夏卫生,吴懿平.微小互连高度下的电子封装焊点微观组织[J].焊接学报,2011,32(12):25-28. |
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| 作者姓名： | 王波 莫丽萍 吴丰顺 夏卫生 吴懿平 |
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| 作者单位： | 1. 华中科技大学材料成形及模具国家重点实验室,武汉430074／华中科技大学武汉光电国家实验室,武汉430074
2. 华中科技大学材料成形及模具国家重点实验室,武汉,430074 |
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| 基金项目： | 国家自然科学基金资助项目，现代焊接生产技术国家重点实验室基金 |
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| 摘 要： | 研究了互连高度分别为100，50，20，lOμm四种不同互连高度的铜／锡／铜三明治结构微焊点的微观组织变化．结果表明，随互连高度的降低，焊料层中的铜浓度也随之升高，焊点两侧生成的Cu6Sn5金属间化合物层（intermetallic compound，IMC）厚度随之降低，但其所占焊点的比例却升高．根据IMC层厚度和焊...
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| 关 键 词： | 电子封装焊点 互连高度 微观组织 |
| 收稿时间： | 2010/9/27 0:00:00 |
Microstructure of solder joints with micron stand-off height in electronic packaging |
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| WANG Bo,MO Liping,WU Fengshun,XIA Weisheng and WU Yiping.Microstructure of solder joints with micron stand-off height in electronic packaging[J].Transactions of The China Welding Institution,2011,32(12):25-28. |
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| Authors: | WANG Bo MO Liping WU Fengshun XIA Weisheng and WU Yiping |
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| Affiliation: | State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan 430074, China;Wuhan National Laboratory for Optoelectronics, Wuhan 430074, China,State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan 430074, China,State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan 430074, China;Wuhan National Laboratory for Optoelectronics, Wuhan 430074, China,State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan 430074, China and State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan 430074, China;Wuhan National Laboratory for Optoelectronics, Wuhan 430074, China |
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| Abstract: | |
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| Keywords: | electronic packaging solder joint stand-off height micro structure |
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