Microstructure, Thermal and Wetting Properties of Sn-Bi-Zn Lead-Free Solder

The microstructures, phase transformations, and wettability of Sn-Bi-Zn solder alloys were investigated by scanning electron microscopy, x-ray diffraction, and differential scanning calorimetry (DSC). The results show that the alloys are composed of primary Sn-rich phase or Zn-rich phase, (Sn + Zn) eutectic structure, and (Sn + Bi + Zn) ternary eutectic structure. The microstructural characterization of Sn-xBi-Zn alloys indicates that, with increasing Bi content, more of the eutectic (Sn-Bi-Zn) structures is formed. DSC profiles reveal that the eutectic peak of the samples did not differ very much, but the reaction temperature of the alloys decreases with increased Bi content. The spreading rates of solders increased with the addition of Zn, which affects the interfacial reactions between the solders and copper.