| 晶圆测试探针新的测试价值 |
| |
| 引用本文： | Mark Allison. 晶圆测试探针新的测试价值[J]. 电子工业专用设备, 2008, 37(4): 38-41 |
| |
| 作者姓名： | Mark Allison |
| |
| 作者单位： | Mark Allison（Electroglas Inc.,Sam Jose,Calif） |
| |
| 摘 要： | 晶圆测试探针曾被认为是节约废芯片封装成本的一种方法,现今它却成为工艺控制、成品率管理、产品质量以及总测试成本的一个关键因素。此外,随着组装相关的故障测试之后,封装水准晶圆分选的完全测试不久将会来临。
|
| 关 键 词： | 晶圆测试探针 封装成本 成品率管理 晶圆分选 探卡 测试成本 |
| 文章编号： | 1004-4507(2008)04-0038-04 |
| 修稿时间： | 2008-03-13 |
Wafer Probe Acquires a New Importance in Testing |
| |
| Mark Allison. Wafer Probe Acquires a New Importance in Testing[J]. Equipment for Electronic Products Marufacturing, 2008, 37(4): 38-41 |
| |
| Authors: | Mark Allison |
| |
| Affiliation: | Electroglas Inc.,Sam Jose,Calif |
| |
| Abstract: | Wafer probe was once considered a method for saving packaging costs of bad die. Today, it's a critical elecment in process control, yield management, yield enhancement and customer quality--as well as overall cost of test. Moreover, full testing at wafer sort (probe), followed by testing for assembly-related failures at the package level, may not be far away. |
| |
| Keywords: | Wafer Probe Packaging Costs Yield Management Wafter Sort Probe Cards Cost of Test |
| 本文献已被 维普 万方数据 等数据库收录！ |
