先进封装中引线键合前等离子处理

当今的封装工程师们正面临许多挑战,包括降低封装成本策略、成品率提高工艺过程以及错综复杂的无损伤处理、小尺寸器件如多芯片模块、叠层封装和混合电路封装等。为了确保更高的器件可靠性和最小的制造成本,一种经过充分处理的表面因其能够显著提高键合质量和可靠性而成功地在先进封装的引线键合中扮演了重要角色。气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。这是进行表面处理的一种十分有效的方法,它能够显著地改进制造能力、可靠性以及先进封装的成品率。主要讨论了在引线键合前表面处理采用的等离子体的类型及其相关的一些考虑,并评论了实验结果和环氧树脂排放污染的实例细节及有关衬底材料和器件特性。

Plasma Considerations Prior to Wire Bonding in Advanced Packaging

Today's packaging engineers are faced with many challenges, including cost-saving strategies, yield-enhancing process steps, and damage-free preparat ion of intricate, small geometry devices such as multi-chip modules, stacked pac kages and hybrids. In order to ensure high device reliability and minimize manuf acturing costs, a well-prepared surface for wire bonding plays a very important role in successful advanced packaging since it can significantly improve the qua lity and reliability of the bond. Gas plasma technology can be used to clean p ads prior to wire bonding to improve bond strengths and yields. It is a powerful , efficient resource for surface preparation that can dramatically improve the m anufacturability, reliability, and yield of advanced packages. In this paper, the types of plasma technologies and consideration fo r their use prior to wire bonding will be discussed, and experimental results wi ll be reviewed. Examples specific to epoxy bleed-out contamination and considera tions regarding substrate material and device characteristics will also be addre ssed.