| 磁控溅射镀膜用灭弧电路 |
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| 引用本文： | 江豪成,常天海.磁控溅射镀膜用灭弧电路[J].真空与低温,2000,6(3):161-164. |
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| 作者姓名： | 江豪成 常天海 |
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| 作者单位： | 兰州物理研究所!甘肃兰州730000 |
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| 摘 要： | 为了解决无防弧功能的磁控靶三相整流直流电源在放电过程中电弧对磁控溅射镀膜工业化生产的影响，根据灭弧电路功能和电弧判别方法设计了三种类型的三相可控硅整流电弧电路，有效地抑制了该整流电源电弧造成的危害，大幅度提高了磁控溅射功能，改善了膜层的均匀性和一致性，提高了产品的成品率。
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| 关 键 词： | 磁控溅射 灭弧电路 设计原理 |
THE ELECTRIC CIRCUIT OF ARC AVOIDANCE MAGNETRON SPUTTERING COATING |
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| JIANG Hao-cheng,CHANG Tian-hai,CHEN Zheng.THE ELECTRIC CIRCUIT OF ARC AVOIDANCE MAGNETRON SPUTTERING COATING[J].Vacuum and Cryogenics,2000,6(3):161-164. |
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| Authors: | JIANG Hao-cheng CHANG Tian-hai CHEN Zheng |
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| Abstract: | In order to avoid the effects of the arc on the magnetron sputtering coating industrized production during discharge of the triphase rectified dc power, three kinds of the triphase controlable silicon rectified arc circuit have been designed by the function of the electric circuit of arc avoidance and the methods of quickly judging arc, the damage caused by the recified arc has been efficiently inhibitted, the power of the megnetron sputtering increased, the uniformity of the coating layers improved and the finished products have become more. |
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| Keywords: | magnetron sputtering arc avoidance circuit design principle |
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