PCB测试技术的介绍 |
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引用本文: | 吴平峰,代宣军.PCB测试技术的介绍[J].现代机械,2009(4):90-93. |
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作者姓名: | 吴平峰 代宣军 |
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作者单位: | 1. 贵州电子信息职业技术学院,贵州,凯里,556000 2. 桂林工学院,广西,桂林,541004 |
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摘 要: | 介绍PCB组装前后的缺陷和故障的检测技术:人工目测(MVI)、在线测试(ICT)、自动光学检测(AOI)、自动在线检测(AXI)、功能检测(FT),并分析了从有铅到无铅焊接技术带来的工艺新问题及其测试过程中的应对措施。
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关 键 词: | PCB 测试技术 有铅焊接 无铅焊接 |
Introduction of PCB Testing Technology |
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Affiliation: | WU Pingfeng , DAI Xuanjun |
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Abstract: | Several kinds of test and inspection methods of PCB:MVI ,ICT,AOI ,AXI and FT are introduced in this paper. Then, the testing and inspection new problems occurred in lead-free soldering, especially the methods for the problems from the transition lead soldering to lead-free soldering processing, are analyzed. |
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Keywords: | PCB |
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