| SiP与PoP |
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| 引用本文： | 翁寿松. SiP与PoP[J]. 电子与封装, 2007, 7(5): 1-3 |
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| 作者姓名： | 翁寿松 |
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| 作者单位： | 无锡市罗特电子有限公司,江苏,无锡,214001 |
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| 摘 要： | 文章介绍了SiP与PoP的特点、市场、产品和设计工具。手机、数码相机等便携式数字电子产品是推动SiP、PiP和PoP的主动力。2010年SiP产品市场预计将达100亿美元;2009年PoP、PiP产品市场出货量预计将达21亿块。PoP比PiP更先进,PoP封装中底部为逻辑器件(如基带处理器、应用处理器、多媒体处理器),顶部为存储器。两种器件一般采用FBGA封装,焊球凸起(点)直径300μm,焊球节距0.65mm。
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| 关 键 词： | 系统级封装 堆叠封装 SiP设计工具 |
| 文章编号： | 1681-1070（2007）05-0001-03 |
| 收稿时间： | 2006-12-01 |
| 修稿时间： | 2006-12-01 |
SiP and PoP |
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| WENG Shou-song. SiP and PoP[J]. Electronics & Packaging, 2007, 7(5): 1-3 |
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| Authors: | WENG Shou-song |
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| Abstract: | In this paper, the characteristic, the market, the products and the design tools of the SiP and the PoP are introduced. The portable digital electronic products such as the mobile telephone and the digital cameras are the main power of SiP, PiP and PoP. The SiP product market will be reached at 10 billion dollars in 2010. The PoP/ PiP Product market (sell volume) can be reached at 2.1 billion piece in 2009. The PoP is more advanced than the PiP. In the PoP packaging, the bottom device is the logical device (such as the baseband processor, the applica- tion processor, the multi-media processor) , and the top device is the memory. Two devices are adopting by the FBGA packaging. The diameter of the solder ball is 300μm, and the interval distance of the solder ball is 0.65mm. |
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| Keywords: | system-in-a-package package on package stacking SiP design tool |
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