Adhesion strength of the Sn-9Zn-xAg/Cu interface |
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| Authors: | Tao-Chih Chang Min-Hsiung Hon Moo-Chin Wang |
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| Affiliation: | (1) Department of Materials Science and Engineering, National Cheng Kung University, 70101 Tainan, Taiwan;(2) Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 80782 Kaohsiung, Taiwan |
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| Abstract: | The adhesion strength of the Sn-9Zn-xAg/Cu interface was studied. The strength increased from 3.34±0.68 MPa to 7.79±0.57 MPa
and from 4.75±1.04 MPa to 10.70±0.75 MPa for the Sn-9Zn-1.5Ag/Cu and Sn-9Zn-2.5Ag/Cu interfaces, respectively, as soldered
at 250°C for the soldering time from 10 sec to 30 sec. However, the strength decreased from 8.11±0.72 MPa to 5.61±0.36 MPa
for the Sn-9Zn-3.5Ag/Cu interface at 250°C for 10–30 sec. Both prolonging soldering time and raising temperature are beneficial
for the adhesionstrength enhancement of the Sn-9Zn-1.5Ag/Cu and Sn-9Zn-2.5Ag/Cu interfaces because of the increment of wettability,
but it is detrimental to the Sn-9Zn-3.5Ag/Cu interface because of microvoid formation. |
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| Keywords: | Adhesion strength interface dipping temperature dipping time |
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