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Electrospray Deposition of Photoresist: A Low Impact Method for the Fabrication of Multilayered Films
Authors:Ivo B Rietveld  Naotoshi Suganuma  Kei Kobayashi  Hirofumi Yamada  Kazumi Matsushige
Affiliation:1. Department of Electronic Science and Engineering, Kyoto University, A1‐326, Katsura, Nishikyo‐ku, Kyoto 615‐8510, Japan;2. Current address: Faculté de Pharmacie, Chimie Physique – Case 23, Université Descartes, 4 Avenue de l'Observatoire, 75006 Paris, France;3. Venture Business Laboratory, Kyoto University, Yoshida‐Honmachi, Sakyo‐ku, Kyoto 606‐8501, Japan;4. International Innovation Center, Kyoto University, Katsura, Nishikyo‐ku, Kyoto 615‐8520, Japan
Abstract:Electrospray deposition has been investigated as a substitute for photoresist spin coating. The morphology of Microposit S1813 photoresist films has been studied as a function of several spray conditions including resist concentration, substrate surface, and flow rate. Film morphology is controlled by three process parameters: the surface energy determines the equilibrium conditions of resist on the substrate; the viscosity and volume flux determine the relaxation time for the depositing resist solution after impact on the substrate. Electrosprayed photoresist films have been used for photolithographic patterning and it has been demonstrated that electrospray deposition is an effective method for deposition of photoresist on top of fragile, thin films, which can be used for multilayered thin film fabrication.
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Keywords:electrohydrodynamic atomization  morphology control  photolithography  photoresist  thin films
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