| 添加玻璃粉对Ba2Ti9O20系瓷料低温烧结的影响 |
| |
| 引用本文： | 魏汉光,宋永生,张火光. 添加玻璃粉对Ba2Ti9O20系瓷料低温烧结的影响[J]. 电子元件与材料, 2008, 27(4): 52-54 |
| |
| 作者姓名： | 魏汉光 宋永生 张火光 |
| |
| 作者单位： | 广东风华高新科技股份有限公司,广东,肇庆,526020;广东风华高新科技股份有限公司,广东,肇庆,526020;广东风华高新科技股份有限公司,广东,肇庆,526020 |
| |
| 摘 要： | 采用H3BO3、ZnO、SiO2、Al2O3、Li2CO3和CaCO3等原料,通过高温熔融、淬火等工艺,获得了低熔点玻璃粉,研究了玻璃粉的熔融、力学性能、介电性能及其含量对MLCC瓷料烧结的影响。结果表明:在Ba2Ti9O20主晶相材料中加入质量分数为4%～7%的低熔点玻璃粉,有利于瓷料在910～950℃低温烧结致密,其绝缘电阻率ρ大于1013Ω·cm,tanδ为(1.2～2.0)×10–4,εr为32～38。
|
| 关 键 词： | 无机非金属材料 玻璃粉 软化点 烧结致密 主晶相 液相烧结 介电性能 |
| 文章编号： | 1001-2028(2008)04-0052-03 |
| 修稿时间： | 2007-12-09 |
Effect of glass powder on Ba_2Ti_9O_(20) ceramics of the low-temperature sintering |
| |
| WEI Han-guang,SONG Yong-sheng,ZHANG Huo-guang. Effect of glass powder on Ba_2Ti_9O_(20) ceramics of the low-temperature sintering[J]. Electronic Components & Materials, 2008, 27(4): 52-54 |
| |
| Authors: | WEI Han-guang SONG Yong-sheng ZHANG Huo-guang |
| |
| Affiliation: | WEI Han-guang,SONG Yong-sheng,ZHANG Huo-guang ( Guangdong Fenghua Advanced Technology Co.,Ltd,Zhaoqing 526020,Guangdong Province,China ) |
| |
| Abstract: | The low-melting point glass powder was prepared by high-temperature melting,quenching with H3BO3,ZnO,SiO2,Al2O3,Li2CO3,CaCO3 etc raw materials. The effect of melting temperature,mechanical properties,and dielectric of glass powder on MLCC ceramic sintering were investigated. The results show that adddtions of 4% to 7%(mass fraction) of the low-melting glass powders in Ba2Ti9O20 main crystal phase material,the sintering temperature are decreased effectively and sintered at 910～950 ℃,insulating resistivity ρ of MLCC ceramic is more than 1013Ω·cm,tan δ is (1.2～2)×10–4 and εr is 32～38. |
| |
| Keywords: | non-metallic inorganic material glass powder softening point sintering densification main crystal phase liquid phase sintering dielectric properties |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
