| 增黏树脂与弹性体SBS的相容性以及与热熔压敏胶性能的关系 |
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| 引用本文： | 王宇,林中祥. 增黏树脂与弹性体SBS的相容性以及与热熔压敏胶性能的关系[J]. 中国胶粘剂, 2009, 18(2) |
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| 作者姓名： | 王宇 林中祥 |
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| 作者单位： | 南京林业大学化学工程学院,江苏,南京,210037 |
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| 摘 要： | 热熔压敏胶(HMPSA)是一类不含溶剂的胶粘剂,在工业应用中占据很大的比重。工业上常用的增黏树脂有松香树脂、萜烯树脂和石油树脂三种。增黏树脂与热塑性弹性体SBS(苯乙烯/丁二烯/苯乙烯嵌段共聚物)的相容性存在一定的差异性,从工业角度重点研究和比较了增黏树脂的结构差异与性能之间的关系,并对其一般规律进行了探索。研究结果表明,当增黏树脂的软化点为100～110℃时,相应的HMPSA可获得较低的熔融黏度和较高的剥离强度,其初粘力为1～2cm;当增黏树脂的软化点为100℃时,剥离强度依次为含萜烯树脂HMPSA>含松香树脂HMPSA>含石油树脂HMPSA;当W(增黏树脂)= 210%时(相对于弹性体SBS而言),含石油树脂HMPSA的综合性能劣于含松香树脂(或含萜烯树脂)的HMPSA;当W(增黏树脂)≥210%时,HMPSA的熔融黏度低于10000mPa·s,但持粘力增强(即意味着内聚力增强)。
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| 关 键 词： | 增黏树脂 弹性体 SBS 相容性 结构 热熔压敏胶 |
Compatibility between tackifying resins and elastomer SBS as well as their relation to HMPSA performance |
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| WANG Yu,LIN Zhong-xiang. Compatibility between tackifying resins and elastomer SBS as well as their relation to HMPSA performance[J]. China Adhesives, 2009, 18(2) |
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| Authors: | WANG Yu LIN Zhong-xiang |
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| Affiliation: | School of Chemical Engineering;Nanjing Forestry University;Nanjing 210037;China |
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| Abstract: | Hot-melt pressure-sensitive adhesive(HMPSA) which has high proportion in industrial application is a kind of the solvent-free adhesive.The rosin resins,terpene resin and petroleum resin were three types of common tackifying resin in industry.There are differences in compatibility between tackifying resins and thermoplastic elastomer SBS(styrene-butadiene-styrene block copolymer).The relation between the structural difference of tackifying resins and performance were mainly studied and compared from industry... |
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| Keywords: | SBS |
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