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高固含量聚醚醚酮改性酚醛树脂固化动力学研究
引用本文:刘乃亮,齐暑华,理莎莎,吴利敏,鲁惠玲. 高固含量聚醚醚酮改性酚醛树脂固化动力学研究[J]. 中国胶粘剂, 2011, 20(3)
作者姓名:刘乃亮  齐暑华  理莎莎  吴利敏  鲁惠玲
作者单位:西北工业大学理学院应用化学系,陕西,西安,710129
摘    要:采用溶液聚合法合成了高固含量(>80%)聚醚醚酮(PEEK)改性酚醛树脂(PF),用非等温DSC(差示扫描量热)法和T-β(温度-升温速率)外推法对其固化反应动力学过程进行了研究,并根据Kissinger方程、Ozawa方程和Crane方程等计算出该固化反应的动力学参数。结果表明:改性树脂的凝胶化温度为136.68℃,固化温度为167.16℃,后处理温度为197.39℃;其固化体系的表观活化能为100.02 kJ/mol,频率因子为1.84×106 s-1,反应级数为0.94(近似于1级反应)。

关 键 词:聚醚醚酮  酚醛树脂  增韧  高固含量  固化  动力学

Study on curing kinetics of high solid content PF modified by PEEK
LIU Nai-liang,QI Shu-hua,LI Sha-sha,WU Li-min,LU Hui-ling. Study on curing kinetics of high solid content PF modified by PEEK[J]. China Adhesives, 2011, 20(3)
Authors:LIU Nai-liang  QI Shu-hua  LI Sha-sha  WU Li-min  LU Hui-ling
Abstract:A high solid content(>80%) phenolic resin(PF) modified by polyetheretherketone(PEEK) was synthesized by solution polymerization,and its curing kinetics process was investigated by non-isothermal differential scanning calorimetry(DSC) and T-β(temperature-heating speed) extrapolation.The curing kinetics parameters of PF modified by PEEK were calculated by Kissinger equation,Ozawa equation and Crane equation.The results showed that the gelling temperature,curing temperature and post-processing temperature of the modified resin were 136.68 ℃,167.16 ℃ and 197.39 ℃,respectively.The apparent activation energy(Ea),frequency factor(A)and reaction order(n) of the curing system were 100.02 kJ/mol,1.84×106 s-1 and 0.94(approximately first order reaction),respectively.
Keywords:polyetheretherketone(PEEK)  phenolic resin(PF)  toughening  high solid content  curing  kinetics
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