Emergence of Ag particles and their effects on the mechanical properties of TaN-Ag nanocomposite thin films |
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Authors: | C.C. Tseng W. Wu C.L. Chang |
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Affiliation: | a Department of Materials Engineering, National Chung Hsing University, Taichung, 402, Taiwan b Department of Materials Engineering, Mingchi University of Technology, 84 Gungjuan Road, Taishan, Taipei 24301, Taiwan c Department of Materials Science and Engineering, Mingdao University, Changhua, 52345, Taiwan |
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Abstract: | TaN-Ag nanocomposite films were deposited by reactive co-sputtering on tool steel substrates. The films were then annealed using RTA (Rapid Thermal Annealing) at 350 °C for 2, 4, 8 min respectively to induce the nucleation and growth of Ag particles in TaN matrix and on film surface. C-AFM (Conductive Atomic force Microscopy) and FESEM (Field-Emission Scanning Electron Microscopy) were applied to examine the Ag nano-particles emerged on the surface of these thin films. A nano-indenter and a pin-on-disk tribometer were used to study the effect of annealing on the films' mechanical properties. The results reveal that annealing by RTA can cause Ag nano-particles to emerge on the TaN surface. Consequently, the mechanical properties of the films will vary depending on annealing conditions, Ag content, and Ag particle emergence. |
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Keywords: | Co-sputtering Nanocomposite thin films TaN-Ag C-AFM |
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