Effect of soldering condition on formation of intermetallic phases developed between Sn-0.3Ag-0.7Cu low-silver lead-free solder and Cu substrate |
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| Authors: | Niwat MookamKannachai Kanlayasiri |
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| Affiliation: | a Department of Industrial Engineering Technology, Rajamangala University of Technology Rattanakosin, Wang Klai Kangwon Campus, Prachuapkhirikhan 77110, Thailand
b Department of Industrial Engineering, King Mongkut''s Institute of Technology Ladkrabang, Bangkok 10520, Thailand |
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| Abstract: | In this paper, effect of soldering time and temperature on formation of intermetallic compounds developed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate was investigated. Dip soldering was performed at 250, 270, and 290 °C with soldering time of 5, 10, 15, and 20 s. Either ?-Cu3Sn or η-Cu6Sn5 intermetallic phase was found at the interface between the solder and the substrate depending on the soldering condition, i.e., soldering time and soldering temperature. ?-Cu3Sn was found only when the substrate was soldered at 250 °C for 5 and 10 s. At other soldering conditions, only η-Cu6Sn5 was found at the interfacial zone. Crystal structure of ?-Cu3Sn intermetallic phase was orthorhombic, and it was hexagonal structure for η-Cu6Sn5. Transformation of the intermetallic phases was also discussed. |
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| Keywords: | Metals and alloys Intermetallics Mechanical properties Microstructure |
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