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PFMEA在SMT装配中的应用研究
引用本文:曾成,韩依楠. PFMEA在SMT装配中的应用研究[J]. 电子质量, 2009, 0(8): 44-45,51
作者姓名:曾成  韩依楠
作者单位:中国工程物理研究院电子工程研究所,四川,绵阳,621900
摘    要:SMT装配过程涉及多个设备和多道工序,工艺流程多样,为了保证SMT产品的质量与可靠性,需要采用科学的方法研究SMT装配过程。文章将PFMEA这一可靠性研究工具引入SMT装配过程,简介PFMEA的应用流程,并以单面贴装工艺漉程为例,说明应用PFMEA研究SMT装配过程的实施方法。

关 键 词:SMT  PFMEA  潜在失效模式  失效机理

Research of PFMEA Application in SMT Assembly
Zeng Cheng,Han Yi-nan. Research of PFMEA Application in SMT Assembly[J]. Electronics Quality, 2009, 0(8): 44-45,51
Authors:Zeng Cheng  Han Yi-nan
Affiliation:Institute of Electronic Engineering;China Academy of Engineering Physics;Sichuan Mianyang 621900
Abstract:SMT assembly process involves many equipment and some working procedures, it's technical flow is various. In order to ensure the quality and reliability of SMT products, studying SMT assembly process with reasonable theory is necessary. This paper combines PFMEA and SMT assembly process, introduces the PFMEA application flow , illuminates PFMEA method to study SMT assembly process by taking one-sided SMT assembly as an instance.
Keywords:SMT  PFMEA  potential failure mode  potential cause of failure  
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