| 电子封装用Diamond/Cu复合材料的化学镀镍 |
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| 引用本文： | 王洪波,贾成厂,郭宏.电子封装用Diamond/Cu复合材料的化学镀镍[J].功能材料,2011,42(2):233-236. |
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| 作者姓名： | 王洪波 贾成厂 郭宏 |
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| 作者单位： | 北京科技大学材料科学与工程学院;北京有色金属研究总院国家有色金属复合材料工程技术研究中心; |
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| 基金项目： | 国家高技术研究发展计划(863计划)资助项目(2008AA03Z505) |
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| 摘 要： | 通过采用在Diamond/Cu复合材料表面化学镀镍的方法来改善其焊接性.化学镀镍前,采用SnCl2溶液和PdCl2溶液对复合材料表面进行敏化、活化等预处理.研究了pH值和温度对化学镀镍沉积速度的影响.利用SEM、EDX、XRD和划痕实验等措施对镀层进行了研究,结果表明,在Diamond/Cu复合材料表面获得了均匀、致密...
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| 关 键 词： | Diamond/Cu复合材料 化学镀镍 沉积速度 |
Electroless nickel plating on diamond/Cu composite material for electronic packaging |
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| WANG Hong-bo,JIA Cheng-chang,GUO Hong.Electroless nickel plating on diamond/Cu composite material for electronic packaging[J].Journal of Functional Materials,2011,42(2):233-236. |
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| Authors: | WANG Hong-bo JIA Cheng-chang GUO Hong |
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| Affiliation: | WANG Hong-bo1,JIA Cheng-chang1,GUO Hong2(1.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China,2.National Engineering and Technology Center for Nonferrous Metals Matrix Composites,General Research Institute for Nonferrous Metals,Beijing 100088,China) |
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| Abstract: | The electroless nickel plating was used to improve the weldability of diamond/Cu composite.Before the electroless nickel plating,the pretreatment was applied to the surface of the composite by means of sensitization with SnCl2 solution and subsequent activation with PdCl2 solution.The influence of pH value and temperature on plating rate were studied.The SEM,EDX,XRD and scratching method were used to examined the coating.The results show that a uniform,compact and tight-bonded Ni-P coating could be plated o... |
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| Keywords: | diamond/Cu composite electroless nickel plating plating rate |
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