Damage integral analysis of solder joint fatigue |
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Authors: | John McGroarty B.S. Ph.D. candidate Ravi Subrahmanyan Ph.D. Che-Yu Li Ph.D. |
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Affiliation: | 1. Cornell University, USA 2. Motorola, Phoenix, Arizona
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Abstract: | Thermal fatigue failures in the solder joints used in electronic packages are an important reliability concern. With electronic components moving through the development process quickly, it is practically impossible to test a given design’s fatigue lifetime. Using a damage integral approach, however, accurate estimates of the fatigue lifetime can be generated. Such an approach extrapolates data from accelerated tests and integrates it to determine when failure will occur. |
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