Characterization of dislocations in copper electrodeposits |
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Authors: | Y.-S. Lee D. N. Lee |
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Affiliation: | (1) School of Materials Science and Engineering, College of Engineering, Seoul National University, Seoul, 151-742, South Korea;(2) School of Materials Science and Engineering, College of Engineering, Seoul National University, Seoul, 151-742, South Korea |
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Abstract: | Copper electrodeposits with the [111] orientation were obtained from a copper sulfate bath consisting of 280 g/l CuSO45H2O and 80 g/l H2SO4 at 30°C. The cathode current density was 900 to 1300 A/m2. Dislocations in the electrodeposits were characterized using transmission electron microscopy. Dislocations in each of the (111) grains could be classified into two groups. One group belonged to high density dislocation bundles radiating from one small area, and another group was located between the bundles. The dislocations in the first group were directed along the <112< directions parallel to the (111) plane and of the edge type. About 42 pct of the dislocations in the second group were also parallel to the (111) plane and of the mixed type. In summary, the majority of dislocations in the (111) grains was of edge type lying on the (111) plane. |
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