Negative thermal expansion and electrical properties of Mn3(Cu0.6NbxGe0.4 − x)N (x = 0.05-0.25) compounds |
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Authors: | RJ Huang W Xu XD Xu XQ Pan |
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Affiliation: | a Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, PR China b Graduate University of Chinese Academy of Sciences, Beijing, PR China c Department of Materials Science and Engineering, University of Michigan, Ann Arbor, USA d Advanced Cryogenic Materials, Abingdon, Oxon, UK |
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Abstract: | Bulk materials with the general formula of Mn3(Cu0.6NbxGe0.4 − x)N (x = 0.05, 0.1, 0.15, 0.2, 0.25), Mn3(Cu0.6Ge0.4)N and Mn3(Cu0.7Ge0.3)N were fabricated by mechanical ball milling and solid state sintering. Their thermal expansion coefficients and electrical conductivities were investigated in the temperature range of 80-300 K. It is found that the temperature interval of negative temperature expansion behavior is about 95 K in the samples of Mn3(Cu0.6Nb0.15Ge0.25)N and Mn3(Cu0.6 Nb0.2Ge0.2)N, which is twice as large as that of Mn3(Cu0.7Ge0.3)N. The negative thermal expansion of Mn3(Cu0.6Nb0.15Ge0.25)N can reach to − 19.5 × 10−6 K− 1 in the temperature range of 165 to 210 K. The electrical conductivity of this series materials is in a level of about 2.5 × 106 (Ω m)− 1. |
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Keywords: | Thermal properties Electrical Properties Cryogenic temperature |
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