| 各向异性导电胶倒装封装电子标签的可靠性 |
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| 引用本文： | 陶军磊,安兵,蔡雄辉,吴懿平. 各向异性导电胶倒装封装电子标签的可靠性[J]. 电子工艺技术, 2010, 31(5) |
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| 作者姓名： | 陶军磊 安兵 蔡雄辉 吴懿平 |
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| 作者单位： | 华中科技大学连接与电子封装中心,湖北,武汉,430074;武汉光电国家实验室,湖北,武汉,430074;华中科技大学连接与电子封装中心,湖北,武汉,430074 |
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| 基金项目： | 国家自然科学基金项目 |
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| 摘 要： | 各向异性导电胶(ACA)广泛用于RFID电子标签芯片封装,具有芯片对位方便、热压温度低和工艺时间短的优点.但ACA互连本质上是机械接触,其互连可靠性强烈依赖于粘接界面性质、胶水粘接力及环境稳定性.本文试验表明,168 h高温高湿和D20 mm心轴弯曲对芯片粘接点的电接触性能有所影响;铜模组良品率显著高于铝天线Inlay.
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| 关 键 词： | 电子标签 各向异性导电胶 倒装封装 可靠性 |
Reliability of RFID Inlay Flip-Chip Packaging by Anisotropic Conductive Adhesive |
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| TAO Jun-lei,AN Bing,CAI Xiong-hui,WU Yi-ping. Reliability of RFID Inlay Flip-Chip Packaging by Anisotropic Conductive Adhesive[J]. Electronics Process Technology, 2010, 31(5) |
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| Authors: | TAO Jun-lei AN Bing CAI Xiong-hui WU Yi-ping |
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| Affiliation: | TAO Jun-lei2,AN Bing1,2,CAI Xiong-hui1,WU Yi-ping1,2(1.Wuhan National Laboratory for Optoelectronics,Wuhan 430074,China2.Huazhong University of Science and Technology,China) |
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| Abstract: | Anisotropic conductive adhesive(ACA) has been widely used in RFID chip packaging,and bears the advantages of convenient alignment,low processing temperature,and short processing time.Since ACA interconnection is essentially a mechanical contact,its interconnection reliability severely depends on the nature of the bonding interfaces,the adhesive bonding strength and the environmental stability.The experiments showed that,168 h high temperature and humidity test,and D20 mm mandrel bending test make some impac... |
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| Keywords: | RFID tag Anisotropic conductive adhesive Flip-chip Reliability |
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