| 一种利用有限元法模拟LED芯片结点温度的方法 |
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| 引用本文： | 王劲,梁秉文.一种利用有限元法模拟LED芯片结点温度的方法[J].半导体光电,2007,28(2):228-230. |
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| 作者姓名： | 王劲 梁秉文 |
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| 作者单位： | 南京汉德森科技股份有限公司,江苏,南京,211100;南京汉德森科技股份有限公司,江苏,南京,211100 |
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| 摘 要： | 提出了一种以有限元法估算发光二极管(LED)光源模块结点温度的方法,提出了较详细的计算步骤,最后以6只1 W大功率LED组成的光源模块为例,演示如何以实测为基础,实测与软件试算相结合来估算LED光源模块的芯片结点温度.结果证明该方法具有较好的预测性,可以用来研究LED光源模块的温度分布,从而为研究LED封装材料匹配性、系统可靠性提供一定的参照.
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| 关 键 词： | 有限元 热阻 pn结温 LED光源模块 大功率LED |
| 文章编号： | 1001-5868(2007)02-0228-03 |
| 修稿时间： | 2006-08-22 |
Simulation of pn Junction Temperature of LED with Finite Element Analysis |
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| WANG Jin,LIANG Bing-wen.Simulation of pn Junction Temperature of LED with Finite Element Analysis[J].Semiconductor Optoelectronics,2007,28(2):228-230. |
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| Authors: | WANG Jin LIANG Bing-wen |
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| Affiliation: | Nanjing Handson Corporation. , LTD, Nanjing 211100, CHN |
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| Abstract: | A new method for calculating LED junction temperatures is proposed. Detailed procedures are provided. Taking 1 W high-power LEDs as example, how to get the junction temperature by combining the simulation and temperature measurement of some related points is demonstrated. The results show that this method has a good predication and can be used to study temperature distributions of high-power LED packages. This method provides a tool to study high-power LED packaging design, material and related reliability issues. |
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| Keywords: | finite element analysis heat resistance pn junction temperature LED packaging high power LED |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
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