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Design and fabrication of a planar patch-clamp substrate using a silicon-on-insulator wafer
Zhang Zhenlong, Liu Xiangyang, Mao Yanli. Design and fabrication of a planar patch-clamp substrate using a silicon-on-insulator wafer[J]. Journal of Semiconductors, 2009, 30(9): 096001. doi: 10.1088/1674-4926/30/9/096001 Zhang Z L, Liu X Y, Mao Y L. Design and fabrication of a planar patch-clamp substrate using a silicon-on-insulator wafer[J]. J. Semicond., 2009, 30(9): 096001. doi: 10.1088/1674-4926/30/9/096001.Export: BibTex EndNote
Authors:Zhang Zhenlong  Liu Xiangyang  Mao Yanli
Affiliation:Institute of Optics and Photoelectronic Technology, School of Physics and Electronics, Henan University, Kaifeng 475004, China;Institute of Optics and Photoelectronic Technology, School of Physics and Electronics, Henan University, Kaifeng 475004, China;Institute of Optics and Photoelectronic Technology, School of Physics and Electronics, Henan University, Kaifeng 475004, China
Abstract:noise.
Keywords:planar patch-clamp substrate  silicon-on-insulator  access resistance  capacitance
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