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Wafer level hermetic packaging based on Cu-Sn isothermal solidification technology |
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| Authors: | Cao Yuhan Luo Le |
| Affiliation: | State Key Laboratories of Transducer Technology,Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences,Shanghai 200050,China |
| Abstract: | 10-9 atm cc/s are possible, meeting the demands of MIL-STD-883E. |
| Keywords: | wafer level package Cu-Sn isothermal solidification technology hermeticity |
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