首页 | 本学科首页   官方微博 | 高级检索  
     


Dependence of wet etch rate on deposition, annealing conditions and etchants for PECVD silicon nitride film
Tang Longjuan, Zhu Yinfang, Yang Jinling, Li Yan, Zhou Wei, Xie Jing, Liu Yunfei, Yang Fuhua. Dependence of wet etch rate on deposition, annealing conditions and etchants for PECVD silicon nitride film[J]. Journal of Semiconductors, 2009, 30(9): 096005. doi: 10.1088/1674-4926/30/9/096005 Tang L J, Zhu Y F, Yang J L, Li Y, Zhou W, Xie J, Liu Y F, Yang F H. Dependence of wet etch rate on deposition, annealing conditions and etchants for PECVD silicon nitride film[J]. J. Semicond., 2009, 30(9): 096005. doi: 10.1088/1674-4926/30/9/096005.Export: BibTex EndNote
Authors:Tang Longjuan  Zhu Yinfang  Yang Jinling  Li Yan  Zhou Wei  Xie Jing  Liu Yunfei  Yang Fuhua
Affiliation:Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;State Key Laboratory of Transducer Technology, Shanghai 200050, China;Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;State Key Laboratory of Transducer Technology, Shanghai 200050, China;Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;State Key Laboratory of Transducer Technology, Shanghai 200050, China;Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;State Key Laboratory of Transducer Technology, Shanghai 200050, China;Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;State Key Laboratory of Transducer Technology, Shanghai 200050, China;Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;State Key Laboratory of Transducer Technology, Shanghai 200050, China;Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
Abstract:tchants for SiO2 and SiNx:H. A high etching selectivity of SiO2 over SiNx:H was obtained using highly concentrated buffered HE
Keywords:plasma enhanced chemical vapor deposition  silicon nitride  HF solution  etch rate
本文献已被 万方数据 等数据库收录!
点击此处可从《半导体学报》浏览原始摘要信息
点击此处可从《半导体学报》下载全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号