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Recent progress in sputtering PZT thin films for ferroelectric memories
Authors:Tomoyuki Sakoda  Katsuhiro Aoki  Satoshi Hashimoto  Yukio Fukuda
Affiliation:1. Texas Instruments Tsukuba Research &2. Development Center Ltd. , 17 Miyukigaoka, Tsukuba , Ibaraki , 305-0841 , Japan
Abstract:Abstract

This paper describes amorphous Pb(Zr, Ti)O3 (PZT) thin films deposited by cosputtering Pb(Zr0.5 Ti0.5)O3 and PbO targets. By optimizing the amount of the excess Pb and the deposition temperature, PZT thin films with a single perovskite phase were obtained successfully on Ir substrates and Pt substrates at 520°C. 250-nm-thick PZT films crystallized by rapid thermal annealing (RTA) at 600°C for 20 s exhibited excellent ferroelectric properties: a coercive voltage of 1.0 V, a remanent polarization density of about 40 μC/cm2, and a polarization switching endurance over 1x109 cycles. Although a heat treatment in a reductive ambient causes degradation of ferroelectric properties of PZT thin films, their degraded ferroelectric properties can be easily recovered from by a 1-min RTA in an oxygen at 400°C.
Keywords:amorphous PZT  sputtering  excess Pb  hydrogen-damaged capacitor  rapid thermal process  ferroelectric memory
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