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Pressing Processing Diminishes Outgrowth and Bridging for AgMg/Bi-2223 Tapes
Authors:W. M. Chen   W. Chen   S. H. Zhou   H. Y. Ling  S. S. Jiang
Affiliation:(1) Department of Physics and National Laboratory of Solid State Microstructures, Nanjing University, Nanjing, 210093, People's Republic of China;(2) Institute for Superconducting x& Electronic Materials, University of Wollongong, New South Wales, 2522, Australia;(3) Department of Agricultural and Resource Economics, Oregon State University, Corvallis, Oregon, 97330
Abstract:Multifilamentary Bi-2223 tapes were fabricated by PIT, using a silver alloy sheath with 2.5% magnesium metal. Outgrowth and bridging are major disadvantages for some silver alloy sheathed Bi-2223 tapes. To solve the outgrowth problem, green tapes were pressed with different reduction rates and then sintered at high temperatures. Critical current Ic of the sintered tapes was measured at nitrogen temperature using the four-probe method. The morphology of the filament core was observed with scanning electron microscope (SEM) to investigate outgrowth of sintered tapes with different reduction rates. Outgrowth and bridging on cross and longitudinal sections of filaments were studied using TEM images. Experimental results suggest that pressing processing may diminish outgrowth and bridging. Number of outgrowths and cases of bridging are reduced when the reduction rate increases, but the slope of the reduction falls at large reduction rates. The Ic curve indicates that there is an optimum reduction rate at which Ic reaches a maximum. At the best reduction rate the amount of outgrowth and bridging is close to the lowest. Experimental results show that pressing processing can diminish outgrowth and bridging by as much as 50%. Therefore, proper pressing is an effective method for both diminishing outgrowth and bridging and enhancement of Ic.
Keywords:outgrowth  bridging  pressing  BSCCO  critical current
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