Effect of reflow temperature and substrate roughness on wettability,IMC growth and shear strength of SAC387/Cu bonds

The effect of reflow temperature and substrate surface roughness on wettability, intermetallics and shear strength of Sn–3.8Ag–0.7Cu solder alloy on copper (Cu) substrate was studied. It was found that increase in reflow temperature and substrate surface roughness improved the wettability of solder alloy. The size of needle shaped Cu₆Sn₅ IMCs (intermetallic compounds) increased with increase in temperature. The morphology of IMCs transformed from long to short needles with increase in substrate roughness. Shear strength and shear energy of the solder bond on rough Cu surfaces were found to be higher than that on smooth Cu surfaces. However, the sheared surfaces of the solder bond on rough Cu surface exhibited a transition ridge characterised by sheared IMCs whereas solder bond on smooth Cu surfaces exhibited completely ductile failure. Although, rough surface exhibited higher shear strength and shear energy, smoother surface is preferable due to its predominant bond failure in the solder matrix.