| CURING PROCESS OF PHOTOPOLYMER RESIN BOND DIAMOND TOOLS |
| |
| 作者姓名： | GAO Tao PENG Wei YAO Chunyan Ministry of Education Key Laboratory of Mechanical Manufacture and Automation Zhejiang University of Technology Hangzhou China |
| |
| 作者单位： | GAO Tao PENG Wei YAO Chunyan Ministry of Education Key Laboratory of Mechanical Manufacture and Automation，Zhejiang University of Technology，Hangzhou 310014，China |
| |
| 基金项目： | 国家自然科学基金
,
Advanced Manufacturing Technology
,
Equipment Zhejiang Provincial Key Disciplines, China |
| |
| 摘 要： | Analytical simulation and corresponding proof-test are adopted to study the principle of the curing process of photopolymer resin diamond tools. The influence of the diamond as abrasives in photopolymer resin owing to the absorptivity of the diamond for the UV light on the photopolymer resin curing process is discussed. Based on the above, a kind of diamond tool—dicing blade is selected to analyze the curing process of photopolymer bond diamond tools. An analytical model of curing process is developed and a correlation curve between the depth of polymerization of the photopolymer resin diamond tools and the exposure time to represent the curing process of photopolymer bond dicing blade. A test is done to proof-test the validity of the analytical model and the correlation curve. The simulated data fit the experimental results, which demonstrates the analytical models and numerical algorithm are of high reliability. The analytical simulation method could possibly be used to optimize the curing cycle and improve the quality of the photopolymers resin bond diamond tools.
|
| 关 键 词： | 光敏聚合物 硬化处理 模拟技术 钻石工具 |
CURING PROCESS OF PHOTOPOLYMER RESIN BOND DIAMOND TOOLS |
| |
| GAO Tao PENG Wei YAO Chunyan Ministry of Education Key Laboratory of Mechanical Manufacture and Automation,Zhejiang University of Technology,Hangzhou ,China.CURING PROCESS OF PHOTOPOLYMER RESIN BOND DIAMOND TOOLS[J].Chinese Journal of Mechanical Engineering,2007,20(3):6-8. |
| |
| Authors: | GAO Tao PENG Wei YAO Chunyan |
| |
| Affiliation: | Ministry of Education Key Laboratory of Mechanical ManufactureZhejiang University of Technology, Hangzhou 310014, China |
| |
| Abstract: | Analytical simulation and corresponding proof-test are adopted to study the principle of the curing process of photopolymer resin diamond tools. The influence of the diamond as abrasives in photopolymer resin owing to the absorptivity of the diamond for the UV light on the photopolymer resin curing process is discussed. Based on the above, a kind of diamond tool-dicing blade is selected to analyze the curing process of photopolymer bond diamond tools. An analytical model of curing process is developed and a correlation curve between the depth of polymerization of the photopolymer resin diamond tools and the exposure time to represent the curing process of photopolymer bond dicing blade. A test is done to proof-test the validity of the analytical model and the correlation curve. The simulated data fit the experimental results, which demonstrates the analytical models and numerical algorithm are of high reliability. The analytical simulation method could possibly be used to optimize the curing cycle and improve the quality of the photopolymers resin bond diamond tools. |
| |
| Keywords: | Photopolymer Curing process Simulation Diamond tools DIAMOND TOOLS BOND RESIN PHOTOPOLYMER PROCESS method used optimize curing cycle improve quality models numerical algorithm high reliability simulated data experimental results |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
