| Abstract: | The laser soldering process was introduced in Micro‐USB electronic packaging in this paper. Numerical modeling and analysis was used for laser process parameter design, because experimental measurements of peak temperature and soldering stress are expensive and often intractable. Accurate knowledge of the residual stress and distortion is a prerequisite for the reliability of the electric connector. The present work proposes a three‐dimensional transient heat transfer model of Micro‐USB package laser soldering process. The calculated thermal cycles and distribution are subsequently used to calculate the distortion and thermal stresses. Meanwhile, the effect of process parameters on residual stress and pin distortion was discussed, and the tensile strength, microstructure, and residual stresses of laser soldering were tested. It can be concluded that the proper laser soldering parameters and power can improve the mechanical property of solder joints on Micro‐USB connector. Copyright © 2014 John Wiley & Sons, Ltd. |
