高速PCB中的过孔设计研究

传输线的不连续问题已成为当今高速数字设计研究的重点，尤其是高速多层板中的过孔结构。随着频率的增长和信号上升沿的变陡，过孔带来的阻抗不连续会引起信号的反射，严重影响系统的性能和信号完整性。文章运用全波电磁仿真软件HFSS，对多种过孔结构进行了全面的研究。通过建立三维物理模型，分析了过孔直径、过孔长度和多余的过孔短柱几种关键设计参数对高速电路的信号完整性的影响。

Research on Via Design in High-speed PCB

Research on discontinuity in transmission lines has became the emphasis in modern high-speed digital designs,especially the vias in multi-layer board.As frequency increases and signal rise time reduces,via causes impedance discontinuities resulting in signal reflections and hence deterioration of signal integrity and system performance.The paper carries out a comprehensive study of various via structures using a full-wave electromagnetic simulator(HFSS).The impact of via diameter,via height and the excess v...