| 硅单晶锭多线切割中砂浆作用的研究 |
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| 引用本文： | 李保军,冯涛.硅单晶锭多线切割中砂浆作用的研究[J].半导体技术,2007,32(6):512-515. |
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| 作者姓名： | 李保军 冯涛 |
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| 作者单位： | 中国电子科技集团公司,第四十六所,天津,300220;中国电子科技集团公司,第四十六所,天津,300220 |
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| 摘 要： | 目前,在较长的硅单晶锭切割领域,多线切割机已基本取代内圆切片机.切割砂浆在切割中有着极其重要的作用,不同的使用条件会直接影响切割晶片的几何参数.讨论了砂浆的使用条件与切割质量之间的关系,通过试验及对高速摄像机拍摄照片的分析,得出不同砂浆携带方式直接影响到切割出晶片几何参数的结论,并且对多线切割的切割机理作了相应的讨论.
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| 关 键 词： | 多线切割 研磨剂(砂浆) 砂浆作用 |
| 文章编号： | 1003-353X（2007）06-512-04 |
| 修稿时间： | 2007-02-08 |
Study on Slurry Actions at Multi-Wire Saw of Si Ingot |
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| LI Bao-jun,FENG Tao.Study on Slurry Actions at Multi-Wire Saw of Si Ingot[J].Semiconductor Technology,2007,32(6):512-515. |
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| Authors: | LI Bao-jun FENG Tao |
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| Affiliation: | The 46^th Research Institute, CETC, Tianjin 300220, China |
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| Abstract: | At present,the multi-wire saw has already replaced ID saw in longer ingot of semiconductor material slicing.Slurry takes the most important role in slicing.Different conditions affect the geometry parameters of wafer directly.The relation between slurry actions and slicing characteristics was studied.Through the analysis of examination and pictures by high speed vidicon,the conclusion is different slurry taken way directly affect the geometry parameters of wafer.And the processing mechanism of multi-wire saw was also studied. |
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| Keywords: | multi-wire saw abrasive grains(slurry) slurry actions |
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