液相烧结制备电力开关用W-7Cu-xNi合金微观组织及性能分析

为了提高电力开关用W-7Cu合金的综合性能，通过添加Ni元素方式对其进行加强，以液相烧结、机械球磨方式制备得到包含不同Ni含量的W-Cu合金。通过实验测试手段对其微观组织及物理性能进行了施压测试分析。研究结果表明：逐渐提高Ni含量后，形成了更大尺寸W颗粒，相邻颗粒间距降低。W-Cu-4%Ni合金界面形成更优润湿角，获得具有连续网状分布的Cu相，改善了W-Cu组织的分布均匀性，此时Ni元素已经完全与Cu相相溶。当Ni含量提高后，W-Cu合金获得了更大的硬度与致密度，热导率下降，相对密度增加。当加入4%的Ni时，致密度达到了95.6%，热导率从161 W/(m·K)降低为96.4 W/(m·K)，获得了致密度更大合金。

Microstructure and property analysis of W-7Cu-xNi alloy prepared by liquid phase sintering for power switch

In order to improve the comprehensive properties of W-7Cu alloy used for power switch, the w-Cu alloy containing different Ni contents was prepared by liquid phase sintering and mechanical ball milling.The microstructure, phase structure, hardness and thermal conductivity were measured by electron microscope, X-ray diffractometer, hardness tester and laser thermal conductivity tester.The results show that the larger size W particles are formed and the spacing between adjacent particles decreases with the increase of Ni content.The interface of W-Cu-4%Ni alloy forms a better wettability angle and obtains a continuous network distribution of copper phase, which improves the distribution uniformity of W-Cu microstructure. At this time, Ni element is completely dissolved with Cu phase. With the increasing of Ni content, the hardness and density of W-Cu alloy are higher, the thermal conductivity decreases, and the relative density increases. When 4% Ni is added, the density reaches 95.6%, the thermal conductivity decreases from 161 W/(m?K) to 96. 4 W/(m?K), and the alloy with higher density is obtained.