Rapid thermal annealing of neutron transmutation doped silicon

Rapid thermal annealing (RTA) of neutron transmutation doped Si wafers is shown to be an alternative to conventional furnace annealing. Measurements of resistivity and deep level transient spectroscopy (DLTS), demonstrated annealing on wafers with diameters up to 75 mm. A 4.5 kW incoherent-light RTA furnace was used. Evidence for crystalline slip was found but this did not appear to affect the results. The slip was more severe for the larger diameter wafers. Some results from a DLTS examination of a partially rapid-thermal-annealed wafer are presented.