The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys—The effect of Ga |
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| Authors: | Kang-I Chen Kwang-Lung Lin |
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| Affiliation: | (1) Department of Electronics and Information, Tung-Fang Institute of Technology, Kaohsiung County, Taiwan 829, Republic of China;(2) Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701, Republic of China |
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| Abstract: | The microstructures and mechanical properties of Sn-8.55Zn-0.5Ag-0.45Al-yGa (wt.%) lead-free solders were investigated. The
y content of the solders investigated was 0.5–3.0 wt.%. The results indicate that Ga exhibits prominent influence in the microstructure
as well as mechanical properties of the solders. By increasing Ga, the fraction of the Sn/Zn eutectic region decreases and
the Sn-matrix region increases. An increase in the Ga content from 0.5 wt.% to 2.0 wt.% enhances the tensile strength while
degrading the ductility. The mechanical properties and differential scanning calorimetry (DSC) behavior have been compared
with that of the 63Sn-37Pb solder. Gallium lowers the melting point of the Sn-8.55Zn-0.5Ag-0.45Al-yGa solders. The Sn-8.55Zn-0.5Ag-0.45Al-0.5Ga
solders exhibit greater tensile strength and better ductility than the 63Sn-37Pb solder. |
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| Keywords: | Lead-free solder Sn-Zn Sn-Zn-Ag Ga mechanical properties differential scanning calorimetry (DSC) |
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