| 铜在含硅气氛中表面改性的化学热处理研究 |
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| 引用本文： | 沈复初,叶必光,郦剑,毛志远,甘正浩,晋圣发.铜在含硅气氛中表面改性的化学热处理研究[J].材料热处理学报,1996(4). |
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| 作者姓名： | 沈复初 叶必光 郦剑 毛志远 甘正浩 晋圣发 |
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| 作者单位： | 浙江大学 |
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| 摘 要： | 对铜在含硅气氛中低温沉积、随后进行扩散处理的表面化学热处理进行了研究。使用光学显微镜、Ｘ射线衍射（ＸＲＤ）仪、电子探针（ＥＰＭＡ）等对渗层进行了显微硬度、成分和结构分析，探讨了工艺参数对渗层的影响。研究结果表明，通过这种表面化学热处理可以在铜表面形成Ｃｕ５Ｓｉ和Ｃｕ１５Ｓｉ４，其硬度较基体有很大提高。
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| 关 键 词： | 表面改性，低温沉积，化学热处理，铜－硅化合物 |
The Study of a Thermochemical Treatment Method for Surface Modification of Copper |
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| Shen Fuchu, Ye Biguang, Li Jian, Mao Zhiyuan, Gan Zhenghao, Jin Shengfa.The Study of a Thermochemical Treatment Method for Surface Modification of Copper[J].Transactions of Materials and Heat Treatment,1996(4). |
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| Authors: | Shen Fuchu Ye Biguang Li Jian Mao Zhiyuan Gan Zhenghao Jin Shengfa |
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| Affiliation: | Zhejiang University |
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| Abstract: | The reaction of SiH4/H2 mixture with copper has been studied. It is found that a copper-silicide intermetallic compound layer forms when selecting appropriate siliconizing process. The microhardness, components and structure of the layer are studied by means of microscope, XRD and EPMA. The effects of silicating parameters on the layer are demonstrated in this paper. It is also found that the Si diffusion layer which are harder than copper is composed of Cu5Si and Cu15Si4. |
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| Keywords: | surface modification low-temperature deposition thermochemical treatment copper-silicide intermetallic compound |
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