| 焊点的质量与可靠性 |
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| 引用本文： | 李志民. 焊点的质量与可靠性[J]. 印制电路信息, 2004, 0(8): 58-61 |
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| 作者姓名： | 李志民 |
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| 作者单位： | 烽火通信科技股份有限公司,430074 |
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| 摘 要： | 主要介绍了Sn-Pb合金焊接点发生失效的各种表现形式,探讨发生的各种原因及如保在工艺上进行改进以改善焊点的可靠性,提高产品的质量。
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| 关 键 词： | 焊点 失效 质量 可靠性 |
Quality and Reliability of Solder Joint |
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| Li Zhimin. Quality and Reliability of Solder Joint[J]. Printed Circuit Information, 2004, 0(8): 58-61 |
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| Authors: | Li Zhimin |
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| Abstract: | All kinds of failures in solder joint are introduced, whose causes are studied. How to improve joint's quality and reliability is also studied. |
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| Keywords: | solder joint failure quality reliability |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
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